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<article xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:ali="http://www.niso.org/schemas/ali/1.0/" article-type="research-article" dtd-version="1.3" xml:lang="ru">
  <front>
    <journal-meta>
      <journal-id journal-id-type="publisher-id">research-focus</journal-id>
      <journal-title-group>
        <journal-title>Research Focus International Scientific Journal</journal-title>
        <abbrev-journal-title abbrev-type="publisher">Research Focus</abbrev-journal-title>
      </journal-title-group>
      <issn pub-type="epub" publication-format="electronic">2181-3833</issn>
      <publisher>
        <publisher-name>Ilm-fan va innovatsiyalar akademiyasi</publisher-name>
      </publisher>
    </journal-meta>
    <article-meta>
      <article-id pub-id-type="doi">10.66073/researchfocus.v2i1.2851</article-id>
      <article-id pub-id-type="other" assigning-authority="relibrary.uz">REL-A-013787</article-id>
      <title-group>
        <article-title xml:lang="ru">ВИДЫ КЛЕЯ, ИСПОЛЬЗУЕМЫЕ ПРИ ПРОИЗВОДСТВЕ ДСП</article-title>
        <trans-title-group xml:lang="en">
          <trans-title>TYPES OF GLUE USED IN THE PRODUCTION OF PARTICLE BOARD</trans-title>
        </trans-title-group>
        <trans-title-group xml:lang="uz">
          <trans-title>DSP ISHLAB CHIQARISHDA ISHLATILADIGAN YELIM TURLARI</trans-title>
        </trans-title-group>
      </title-group>
      <contrib-group content-type="author">
        <contrib contrib-type="author">
          <string-name>Шайманова Рано</string-name>
          <aff>Термезский инженерно-технологический институт, преподаватель кафедры химической технологии</aff>
        </contrib>
        <contrib contrib-type="author">
          <string-name>Шайманова Наргиза</string-name>
          <aff>Учитель 15 общеобразовательной школы Шерабадского района</aff>
        </contrib>
        <contrib contrib-type="author">
          <string-name>Йулдошева Дильбар Нуриддин кизи</string-name>
          <aff>Термезский инженерно-технологический институт студентка 2 курса химико-технологического направление</aff>
        </contrib>
      </contrib-group>
      <pub-date publication-format="electronic" date-type="pub" iso-8601-date="2023-02-05">
        <day>05</day>
        <month>02</month>
        <year>2023</year>
      </pub-date>
      <pub-date date-type="collection">
        <year>2023</year>
      </pub-date>
      <volume>2</volume>
      <issue>1</issue>
      <fpage>210</fpage>
      <lpage>213</lpage>
      <permissions>
        <license xlink:href="https://creativecommons.org/licenses/by/4.0">
          <ali:license_ref>https://creativecommons.org/licenses/by/4.0</ali:license_ref>
          <license-p>Это произведение доступно по лицензии Creative Commons «Attribution» («Атрибуция») 4.0 Всемирная.</license-p>
        </license>
      </permissions>
      <self-uri xlink:href="https://relibrary.uz/REL-A-013787/"/>
      <abstract xml:lang="ru">
        <p>перед склеиванием стружки клеевую жидкость смешивают с добавками или дозируют в смесительном устройстве. Шкала на входе материала обеспечивает точное измерение количества присутствующего материала. Клей распыляется на щепу или щепа смачивается через поточные форсунки в клеосмесителе объемом 2-6 м. Количество клея в верхнем слое составляет около 4-10%, а в среднем слое около 8-15%. Уровень заполнения миксера поддерживается постоянным за счет электронного контроля крышки на выходе миксера. В данной статье представлена информация о производстве ДСП и клее, используемом при его производстве.</p>
      </abstract>
      <trans-abstract xml:lang="en">
        <p>Before gluing the chips, the adhesive liquid is mixed with additives or dosed in a mixing device. A scale at the material inlet provides an accurate measurement of the amount of material present. The glue is sprayed onto the chips or the chips are wetted through in-line nozzles in a 2-6 m glue mixer. The amount of glue in the top layer is about 4-10%, and in the middle layer about 8-15%. The filling level of the mixer is kept constant by electronic control of the lid at the outlet of the mixer. This article provides information on the production of chipboard and the adhesive used in its production.</p>
      </trans-abstract>
      <trans-abstract xml:lang="uz">
        <p>Qipiqlarni yelimlashdan oldin yelim suyuqligi qo‘shimchalar bilan aralashtiriladi yoki aralashtirish qurilmasida dozalanadi. Material kirish qismidagi shkala mavjud material miqdorini aniq o‘lchashni ta‘minlaydi. Yelim payrahalarga purkaladi yoki payrahalar hajmi 2-6 m bo‘lgan yelim aralashtirgichdagi oqimli forsunkalar orqali namlanadi. Yuqori qatlamdagi yelim miqdori taxminan 4-10% ni, o‘rta qatlamda esa taxminan 8-15% ni tashkil etadi. Mikserning to‘ldirilish darajasi mikser chiqishidagi qopqoqni elektron nazorat qilish hisobiga doimiy saqlab turiladi. Mazkur maqolada DSP ishlab chiqarish va uni ishlab chiqarishda foydalaniladigan yelim haqida ma‘lumot berilgan.</p>
      </trans-abstract>
      <kwd-group xml:lang="ru">
        <kwd>Клей для ДСП</kwd>
        <kwd>синтез клея</kwd>
        <kwd>формальдегид</kwd>
        <kwd>новые методы</kwd>
      </kwd-group>
      <kwd-group xml:lang="en">
        <kwd>Chipboard glue</kwd>
        <kwd>glue synthesis</kwd>
        <kwd>formaldehyde</kwd>
        <kwd>new methods</kwd>
      </kwd-group>
      <kwd-group xml:lang="uz">
        <kwd>DSP uchun yelim</kwd>
        <kwd>yelim sintezi</kwd>
        <kwd>formaldegid</kwd>
        <kwd>yangi usullar</kwd>
      </kwd-group>
    </article-meta>
  </front>
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